Presentation

Electronic version of the Call For Paper: pdf format

The IEEE International Symposium on Rapid System Prototyping (RSP) explores trends in Rapid Prototyping of Computer Based Systems. Its scope ranges from formal methods for the verification of systems, engineering methods, process and tool chains to case studies of actual software and hardware systems. It aims to bring together researchers from the hardware and software communities to share their experiences and to foster collaboration of new and innovative Science and Technology.

The 21st annual Symposium focus will encompass theoretical and practical methodologies, resolving technologies of specification, completeness, dynamics of change, technology insertion, complexity, integration, and time to market. Submission of industrial research is welcome. Keynote presentations and formal paper sessions will provide baseline knowledge for discussion and group integration. Suggested topics include, but are not limited to:

Specification and language models for hardware/software systems Software and Systems Architecture and Integration Methodologies and tools for hardware and software intensive systems FPGAs , SoCs, NoCs and MPSoCs Heterogeneous multi-domain systems Very large scale system engineering Software/Configware/Hardware codesign and tradeoffs System verification/validation

Applying formal methods to prototyping Reliability and failure analysis Emerging Technologies and Applications Prototypes in engineering processes Model Driven Engineering and prototyping Prototyping of embedded/real-time systems Virtual prototyping of physical systems Prototype to product transition Prototyping case studies Reconfigurable products or systems Industrial Designs

For years, extended versions of best papers have been proposed to be published in special issues of prestigious journals. This strategy will be continued for RSP 2010: authors of the best accepted papers will be invited to submit extended versions of their papers for publication in a special issue of the Software: Practice and Experience journal.

Papers

The program committee invites authors to submit full papers. Papers should clearly describe the nature of the work, explain its significance, highlight its novel features, and state its current status. Authors of selected papers will be requested to prepare a manuscript for the symposium proceedings. Paper length should not exceed 7 pages in the standard IEEE format. Submission instructions as well as templates can be found in the RSP web site.

A special session will be dedicated to the discussion of new, unpublished ongoing work. Authors may submit a 3 page paper in IEEE format. Selected contributions will be published in the proceedings and a dedicated session with posters will be organized.

The program committee also invites tutorial speakers for giving lectures on RSP topics, for both academic and industrial attendees.

• Paper registration: February 12, 2010 (extended, was February 5, 2010) :
  only title, authors, email contact and abstract are required via the web site
• Paper submission: February 16, 2010 (extended, was February 10, 2010) :
  full paper in pdf or ps format
• Notification of Acceptance: April 13, 2010
• Final Camera Ready Manuscript due: April 30, 2010

Paper submission

Electronically submit all papers using:

http://www.easychair.org/conferences/?conf=rsp2010

Here are the guidelines from the IEEE. Please follow them carefully.

For any submission question, please contact the general chair.

Chairs

General Chair

G. Nicolescu - Polytechnique Montreal, Canada

Program Chairs

P. Athanas - Virginia Tech, USAE
J. Hugues - ISAE, France

Tutorial Chair

A. Jerraya - LETI-CEA, France

Publicity Chair

B. Zalila - ENIS, Tunisia

IEEE Liaison Chair

A. Stevens - IEEE Reliability Society, USA

Organizing Chair

D. Wijesekera - George Mason University, USA

Finance Chair

M-T. Shing - Naval Postgraduate School, USA

Commitees

Steering Committee

• P. Athanas -Virginia Tech., USA
• D. Buchs - Univ. Geneva, Switzerland
• M. Glesner - Darmstadt Univ. of Tech., Germany
• W. Hardt - Tech. Univ. Chemnitz, Germany
• F. Hessel - PUCRS, Brazil
• J. Hugues - TELECOM ParisTech, France
• A. Jerraya - LETI-CEA, France
• K. Kent - Univ. New Brunswick, Canada
• F. Kordon - Univ. P. & M. Curie, France
• R. Lauwereins - IMEC, Belgium
• B. Michael - Naval Postgraduate School, USA
• K. Mueller-Glaser - Univ. Karlsruhe, Germany
• G. Nicolescu - Ecole Polytechnique de Montréal, Canada
• F. Rousseau - TIMA, France
• M. Shing - Naval Postgraduate School, USA
• J. Voas - SAIC, USA

Program Committee

• M. Aboulhamid - Univ. Montréal
• G. Alexiou - Univ. Patras & RA-CTI
• T. Antonakopoulos - Univ. Patras
• M. Auguston - Naval Postgraduate School
• A. Baghdadi - ENST-Bretagne
• J. Becker - Univ. Karlsruhe
• C. Bobda - Univ. Kaiserslautern
• G. Bois - Ecole Polytechnique de Montréal
• R. Drechsler - Univ. Bremen
• J. Drummond - SSC San Diego, USA
• M. Engels - FMTC
• A. Frolich - UFCS/LISHA
• D. Hamilton - Auburn Univ.
• J. Henkel - Univ. Karlsruhe, Germany
• G. Karsai - Univ. Vanderbilt, USA
• R. Kress - Infineon Technologies
• I. Krueger - UCSA, USA
• T. Le - National Univ. of Singapore
• M. Lemoine - ONERA, France
• P. Leong - Chinese University of Hong Kong
• R. Ludewig - IBM
• V. Olive - France Telecom R&D
• Y. Papaefstathiou - Tech. Univ. of Crete
• C. Park - Samsung, Korea
• L. Pautet - TELECOM ParisTech, France
• C. Pereira - UFRGS, Brazil
• F. Petrot - TIMA, France
• R. Pettit - AEROSpace Org, USA
• D. Pnevmatikatos - Tech. Univ. of Crete
• J. Puett - HQ NETCOM
• J. Rice - Univ. Lethbridge
• O. Sokolsky - U. Penn
• T. Taha - Clemson Univ, USA
• E. Todt - UFPR, Brazil
• L. Wills - Georgia Tech., USA