Presentation

Electronic version of the Call For Paper: pdf format

Poster:

The IEEE/IFIP International Symposium on Rapid System Prototyping (RSP) explores trends in Rapid Prototyping of Computer Based Systems. Its scope ranges from formal methods for the verification of systems, engineering methods, process and tool chains to case studies of actual software and hardware systems. It aims to bring together researchers from the hardware and software communities to share their experiences and to foster collaboration of new and innovative Science and Technology. The 20th annual Symposium’s focus will encompass theoretical and practical methodologies, resolving technologies of specification, completeness, dynamics of change, technology insertion, complexity, integration, and time to market. Submission of industrial research is welcome. Keynote presentations and formal paper sessions will provide baseline knowledge for discussion and group integration. Suggested topics include, but are not limited to:

Specification and language models for hardware/software systems Software and Systems Architecture and Integration Methodologies and tools for hardware and software intensive systems FPGAs , SoCs, NoCs and MPSoCs Very large scale system engineering Software/Configware/Hardware codesign and tradeoffs System verification/validation Applying formal methods to prototyping

Prototypes in engineering processes Model Driven Engineering and prototyping Prototyping of embedded/real-time systems Virtual prototyping of physical systems Prototype to product transition Prototyping case studies Reconfigurable products or systems

For its 20th edition, RSP will be collocated with the 30th International Conference on Application and Theory of Petri Nets and Other Models of Concurrency (ICAPTN'09). Authors are encouraged to focus on the integration of formal methods in prototyping, and related issues.

Confirmed keynote speakers are Joseph Sifakis, Verimag France, Bernard Courtois, France and Bill Tonti, IBM, USA

For years, extended versions of best papers have been proposed to be published in special issues of prestigious journals. This strategy will be continued for RSP'09.

This year, a Special Session will be about Automotive Software Engineering. Submission of papers to this application domain is strongly encouraged.

Papers

The program committee invites authors to submit full papers. Papers should clearly describe the nature of the work, explain its significance, highlight its novel features, and state its current status. Authors of selected papers will be requested to prepare a manuscript for the symposium proceedings. Paper length should not exceed 7 pages in the standard IEEE format. Submission instructions as well as templates can be found in the RSP web site (see bottom of this CFP).

A special session will be dedicated to the discussion of new, unpublished ongoing work. Authors may submit a 3 page paper in IEEE format. Selected contributions will be published in the proceedings and a dedicated session with posters will be organized.

• Paper registration: January 9, 2009 :
  only title, authors, email contact and abstract are required via the web site
• Paper submission: January 17, 2009 :
  full paper in pdf or ps format
• Notification of Acceptance: March 2, 2009
• Final Camera Ready Manuscript due: April 4, 2009

Paper submission

Electronically submit all papers using:

http://www.easychair.org/conferences/?conf=rsp09

Here are the guidelines from the IEEE Computer Society Press. Please read the following carefully.

Guidelines in pdf format or text format.

Download: LaTeX style, Word template

For any submission question, please contact one of the general chair.

Chairs

General Chairs

J. Hugues - TELECOM ParisTech, France
B. Michael - Naval Postgraduate School, USA

Program Chairs

I. Krueger - UCSD, USA
F. Rousseau - TIMA, France

Tutorial Chair

A. Jerraya - LETI-CEA, France

Publicity Chair

B. Zalila - ENIS, Tunisia

Organizing Chair

S. Vignes - TELECOM ParisTech, France

Commitees

Steering Committee

• P. Athanas -Virginia Tech., USA
• D. Buchs - Univ. Geneva, Switzerland
• M. Glesner - Darmstadt Univ. of Tech., Germany
• W. Hardt - Tech. Univ. Chemnitz, Germany
• F. Hessel - PUCRS, Brazil
• J. Hugues - TELECOM ParisTech, France
• A. Jerraya - LETI-CEA, France
• K. Kent - Univ. New Brunswick, Canada
• F. Kordon - Univ. Paris 6, France
• R. Lauwereins - IMEC, Belgium
• B. Michael - Naval Postgraduate School, USA
• K. Mueller-Glaser - Univ. Karlsruhe, Germany
• G. Nicolescu - Ecole Polytechnique de Montréal, Canada
• M. Shing - Naval Postgraduate School, USA
• J. Voas - SAIC, USA

Program Committee

• M. Aboulhamid - Univ. Montréal
• G. Alexiou - Univ. Patras & RA-CTI
• T. Antonakopoulos - Univ. Patras
• M. Auguston - Naval Postgraduate School
• A. Baghdadi - ENST-Bretagne
• J. Becker - Univ. Karlsruhe
• C. Bobda - Univ. Kaiserslautern
• G. Bois - Ecole Polytechnique de Montréal
• R. Drechsler - Univ. Bremen
• J. Drummond - SSC San Diego, USA
• M. Engels - FMTC
• A. Frolich - UFCS/LISHA
• D. Hamilton - Auburn Univ.
• R. Hartenstein - Tech. Univ. Kaiserlautern
• J. Henkel - Univ. Karlsruhe, Germany
• G. Karsai - Univ. Vanderbilt, USA
• R. Kress - Infineon Technologies
• I. Krueger - UCSA, USA
• T. Le - National Univ. of Singapore
• M. Lemoine - ONERA, France
• P. Leong - Chinese University of Hong Kong
• R. Ludewig - IBM
• V. Olive - France Telecom R&D
• Y. Papaefstathiou - Tech. Univ. of Crete
• C. Park - Samsung, Korea
• L. Pautet - TELECOM ParisTech, France
• C. Pereira - UFRGS, Brazil
• F. Petrot - TIMA, France
• R. Pettit - AEROSpace Org, USA
• D. Pnevmatikatos - Tech. Univ. of Crete
• J. Puett - HQ NETCOM
• J. Rice - Univ. Lethbridge
• F. Rousseau - TIMA, France
• T. Taha - Clemson Univ, USA
• E. Todt - UFPR, Brazil
• L. Wills - Georgia Tech., USA